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INTEGRATED CIRCUITS
DATA SHEET
UDA1334TS Low power audio DAC
Preliminary specification File under Integrated Circuits, IC01 1999 Nov 11
Philips Semiconductors
Preliminary specification
Low power audio DAC
CONTENTS 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 8.5 8.5.1 8.5.2 8.5.3 8.5.4 FEATURES General Multiple format data interface DAC digital sound processing Advanced audio configuration APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION QUICK REFERENCE DATA BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION System clock Interpolation filter Noise shaper Filter stream DAC Feature settings Digital interface format select Mute control De-emphasis control Power control and sampling frequency select 9 10 11 12 13 14 14.1 14.2 14.3 15 16 17 17.1 17.2 17.3 17.4 17.5 18 19 LIMITING VALUES HANDLING
UDA1334TS
THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS 2.0 V supply voltage 3.0 V supply voltage Timing APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DEFINITIONS LIFE SUPPORT APPLICATIONS
1999 Nov 11
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Philips Semiconductors
Preliminary specification
Low power audio DAC
1 1.1 FEATURES General
UDA1334TS
* 1.8 to 3.6 V power supply voltage * Integrated digital filter plus DAC * Supports sample frequencies from 8 to 100 kHz * Automatic system clock versus sample rate detection * Low power consumption * No analog post filtering required for DAC * Slave mode only applications * Easy application * SSOP16 package. 1.2 Multiple format data interface 2 APPLICATIONS
This audio DAC is excellently suitable for digital audio portable application, such as portable MD, MP3 and DVD players. 3 GENERAL DESCRIPTION
* I2S-bus and LSB-justified format compatible * 1fs input data rate. 1.3 DAC digital sound processing
The UDA1334TS supports the I2S-bus data format with word lengths of up to 24 bits and the LSB-justified serial data format with word lengths of 16, 20 and 24 bits. The UDA1334TS has basic features such as de-emphasis (at 44.1 kHz sampling rate) and mute.
* Digital de-emphasis for 44.1 kHz sampling rate * Mute function. 1.4 Advanced audio configuration
* High linearity, wide dynamic range and low distortion * Standby or Sleep mode in which the DAC is powered down. 4 ORDERING INFORMATION TYPE NUMBER UDA1334TS PACKAGE NAME SSOP16 DESCRIPTION plastic shrink small outline package; 16 leads; body width 4.4 mm VERSION SOT369-1
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Philips Semiconductors
Preliminary specification
Low power audio DAC
5 QUICK REFERENCE DATA SYMBOL Supplies VDDA VDDD IDDA IDDD Tamb DAC analog supply voltage digital supply voltage DAC analog supply current digital supply current ambient temperature normal operation Sleep mode normal operation Sleep mode Digital-to-analog convertor (VDDA = VDDD = 2.0 V) Vo(rms) (THD + N)/S output voltage (RMS value) at 0 dB (FS) digital input; note 1 - - - - - - - - - - - - - - - - - - 500 -80 -37 -75 -35 97 95 110 100 1.8 1.8 - - - - -20 2.0 2.0 2.1 150 1.2 50 - PARAMETER CONDITIONS MIN.
UDA1334TS
TYP.
MAX.
UNIT
3.6 3.6 - - - - +85 - - - - - - - - - - - - - - - - - -
V V mA A mA A C
mV dB dB dB dB dB dB dB dB
total harmonic fs = 44.1 kHz; at 0 dB distortion-plus-noise to signal ratio fs = 44.1 kHz; at -60 dB; A-weighted fs = 96 kHz; at 0 dB fs = 96 kHz; at -60 dB; A-weighted
S/N
signal-to-noise ratio
fs = 44.1 kHz; code = 0; A-weighted fs = 96 kHz; code = 0; A-weighted MUTE = HIGH; A-weighted
cs
channel separation
Digital-to-analog convertor (VDDA = VDDD = 3.0 V) Vo(rms) (THD + N)/S output voltage (RMS value) at 0 dB (FS) digital input; note 1 750 -90 -40 -85 -37 100 98 110 100 mV dB dB dB dB dB dB dB dB
total harmonic fs = 44.1 kHz; at 0 dB distortion-plus-noise to signal ratio fs = 44.1 kHz; at -60 dB; A-weighted fs = 96 kHz; at 0 dB fs = 96 kHz; at -60 dB; A-weighted
S/N
signal-to-noise ratio
fs = 44.1 kHz; code = 0; A-weighted fs = 96 kHz; code = 0; A-weighted MUTE = HIGH; A-weighted
cs
channel separation
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Philips Semiconductors
Preliminary specification
Low power audio DAC
UDA1334TS
SYMBOL
PARAMETER
CONDITIONS - - -
MIN.
TYP.
MAX. - - -
UNIT
Power dissipation (at fs = 44.1 kHz) P power dissipation play-back mode; at 2.0 V supply voltage play-back mode; at 3.0 V supply voltage Sleep mode Note 1. The DAC output voltage scales proportional to the power supply voltage. 6 BLOCK DIAGRAM 7.0 17 0.5 mW mW mW
handbook, full pagewidth
VDDD 4 1 2 3
VSSD 5
BCK WS DATAI
DIGITAL INTERFACE
UDA1334TS
SYSCLK MUTE DEEM PCS 6 8 9 10
DE-EMPHASIS 7 INTERPOLATION FILTER 11 SFOR1 SFOR0
NOISE SHAPER
VOUTL
14
DAC
DAC
16
VOUTR
13 VDDA
15 VSSA
12 Vref(DAC)
MGL877
Fig.1 Block diagram.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
7 PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PAD TYPE 5 V tolerant digital input pad; note 1 5 V tolerant digital input pad; note 1 5 V tolerant digital input pad; note 1 digital supply pad digital ground pad 5 V tolerant digital input pad; note 1 5 V tolerant digital input pad; note 1 5 V tolerant digital input pad; note 1 5 V tolerant digital input pad; note 1 3-level input pad; note 2 digital input pad; note 2 analog pad analog supply pad analog output pad analog ground pad analog output pad bit clock input word select input serial data input digital supply voltage digital ground system clock input serial format select 1 mute control de-emphasis control
UDA1334TS
SYMBOL BCK WS DATAI VDDD VSSD SYSCLK SFOR1 MUTE DEEM PCS SFOR0 Vref(DAC) VDDA VOUTL VSSA VOUTR Notes
DESCRIPTION
power control and sampling frequency select serial format select 0 DAC reference voltage DAC analog supply voltage DAC output left DAC analog ground DAC output right
1. 5 V tolerant is only supported if the power supply voltage is between 2.7 and 3.6 V. For lower power supply voltages this is maximum 3.3 V tolerant. 2. Because of test issues these pads are not 5 V tolerant and they should be at power supply voltage level or at a maximum of 0.5 V above that level.
handbook, halfpage
BCK 1 WS 2 DATAI 3 VDDD 4 VSSD 5 SYSCLK 6 SFOR1 7 MUTE 8
MGL878
16 VOUTR 15 VSSA 14 VOUTL 13 VDDA 12 Vref(DAC) 11 SFOR0 10 PCS 9 DEEM
UDA1334TS
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
8 8.1 FUNCTIONAL DESCRIPTION System clock Table 2
UDA1334TS
Example using a 12.228 MHz system clock CLOCK MODE 128fs 192fs 256fs 384fs 512fs 768fs
SAMPLING FREQUENCY 96 kHz 64 kHz(1) 48 kHz 32 kHz 24 kHz 16 kHz Note
The UDA1334TS operates in slave mode only; this means that in all applications the system must provide the system clock and the digital audio interface signals (BCK and WS). The system clock must be locked in frequency to the digital interface signals. The UDA1334TS automatically detects the ratio between the SYSCLK and WS frequencies. The BCK clock can be up to 64fs, or in other words the BCK frequency is 64 times the Word Select (WS) frequency or less: fBCK 64 x fWS. Important: the WS edge MUST fall on the negative edge of the BCK at all times for proper operation of the digital I/O data interface. The modes which are supported are given in Table 1. Table 1 Supported sampling ranges SAMPLING RANGE 8 to 55 kHz 8 to 100 kHz 8 to 100 kHz 8 to 100 kHz 8 to 100 kHz(1)(2) 8 to 100 kHz(2) 8.3
1. This mode can only be supported for power supply voltages down to 2.4 V. For lower voltages, in 192fs mode the sampling frequency should be limited to 55 kHz. 8.2 Interpolation filter
The interpolation digital filter interpolates from 1fs to 64fs by cascading FIR filters (see Table 3). Table 3 Interpolation filter characteristics CONDITION 0 to 0.45fs >0.55fs 0 to 0.45fs VALUE (dB) 0.02 -50 >114
CLOCK MODE 768fs 512fs 384fs 256fs 192fs 128fs Notes
ITEM Pass-band ripple Stop band Dynamic range Noise shaper
1. This mode can only be supported for power supply voltages down to 2.4 V. For lower voltages, in 192fs mode the sampling frequency should be limited to 55 kHz. 2. Not supported in low-sampling frequency mode. An example is given in Table 2 for a 12.228 MHz system clock input.
The 5th-order noise shaper operates at 64fs. It shifts in-band quantization noise to frequencies well above the audio band. This noise shaping technique enables high signal-to-noise ratios to be achieved. The noise shaper output is converted into an analog signal using an Filter Stream DAC (FSDAC).
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Philips Semiconductors
Preliminary specification
Low power audio DAC
8.4 Filter stream DAC 8.5.3 DE-EMPHASIS CONTROL
UDA1334TS
The FSDAC is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. The filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. In this way very high signal-to-noise performance and low clock jitter sensitivity is achieved. No post-filter is needed due to the inherent filter function of the DAC. On-board amplifiers convert the FSDAC output current to an output voltage signal capable of driving a line output. The output voltage of the FSDAC scales proportional with the power supply voltage. 8.5 Feature settings
De-emphasis can be switched on for fs = 44.1 kHz by setting pin DEEM at HIGH level. The function description of pin DEEM is given in Table 6. Table 6 De-emphasis control FUNCTION de-emphasis off de-emphasis on
DEEM LOW HIGH 8.5.4
POWER CONTROL AND SAMPLING FREQUENCY
SELECT
Pin PCS is a 3-level pin and is used to set the mode of the UDA1334TS. The definition is given in Table 7. Table 7 PCS LOW MID HIGH PCS function definition FUNCTION normal operating mode low sampling frequency mode Power-down or Sleep mode
The features of the UDA1334TS can be set by control pins SFOR1, SFOR0, MUTE, DEEM and PCS. 8.5.1 DIGITAL INTERFACE FORMAT SELECT
The digital audio interface formats (see Fig.3) can be selected via the pins SFOR1 and SFOR0 as shown in Table 4. The BCK frequency for the digital audio interface can be maximum 64 times the WS frequency: fBCK 64fWS. Table 4 Data format selection SFOR0 LOW HIGH LOW HIGH INPUT FORMAT I2S-bus input LSB-justified 16 bits input LSB-justified 20 bits input LSB-justified 24 bits input
SFOR1 LOW LOW HIGH HIGH 8.5.2
The low sampling frequency mode is required to have a higher oversampling rate in the noise shaper in order to improve the signal-to-noise ratio. In this mode the oversampling ratio of the noise shaper will be 128fs instead of 64fs.
MUTE CONTROL
The output signal can be soft muted by setting pin MUTE to HIGH level as shown in Table 5. Table 5 Mute control MUTE LOW HIGH FUNCTION mute off mute on
When the output signal is fully muted (pin MUTE at HIGH level), a silence switch inside the FSDAC is activated. In this way a very high signal-to-noise ratio can be achieved in case the output is muted.
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WS 1 BCK 2 3 LEFT >=8 1 2 3 RIGHT >=8 DATA MSB B2 MSB B2 I2S-BUS FORMAT WS LEFT 16 BCK 15 2 1 DATA MSB B2 B15 LSB LSB-JUSTIFIED FORMAT 16 BITS
Philips Semiconductors
handbook, full pagewidth
MSB RIGHT 16 15 2 1 MSB B2 B15 LSB
Low power audio DAC
9
WS LEFT 20 BCK 19 18 17 16 15 2 1 RIGHT 20 19 18 17 16 15 2 1 DATA MSB B2 B3 B4 B5 B6 B19 LSB LSB-JUSTIFIED FORMAT 20 BITS MSB B2 B3 B4 B5 B6 B19 LSB WS 24 BCK 23 22 21 LEFT 20 19 18 17 16 15 2 1 24 23 22 21 RIGHT 20 19 18 17 16 15 2 1 DATA MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 B23 LSB LSB-JUSTIFIED FORMAT 24 BITS MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 B23 LSB
Preliminary specification
MGS752
UDA1334TS
Fig.3 Digital audio formats.
Philips Semiconductors
Preliminary specification
Low power audio DAC
9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Txtal(max) Tstg Tamb Ves supply voltage maximum crystal temperature storage temperature ambient temperature electrostatic handling voltage human body model machine model Note 1. All supply connections must be made to the same power supply. 10 HANDLING PARAMETER CONDITIONS note 1 - - -65 -20 -2000 -200 MIN.
UDA1334TS
MAX. 4.0 150 +125 +85 +2000 +200 V
UNIT C C C V V
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. 11 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE 145 UNIT K/W
thermal resistance from junction to ambient in free air
12 QUALITY SPECIFICATION In accordance with "SNW-FQ-611-E". 13 DC CHARACTERISTICS VDDD = VDDA = 2.0 V; Tamb = 25 C; RL = 5 k. All voltages with respect to ground (pins VSSA and VSSD); unless otherwise specified. SYMBOL Supplies VDDA VDDD IDDA DAC analog supply voltage digital supply voltage DAC analog supply current note 1 note 1 normal operating mode; at 2.0 V supply voltage normal operating mode; at 3.0 V supply voltage Sleep mode IDDD digital supply current normal operating mode; at 2.0 V supply voltage normal operating mode; at 3.0 V supply voltage Sleep mode 1.8 1.8 - - - - - - 2.0 2.0 2.1 3.3 150 1.2 2.1 50 3.6 3.6 - - - - - - V V mA mA A mA mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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Philips Semiconductors
Preliminary specification
Low power audio DAC
UDA1334TS
SYMBOL
PARAMETER
CONDITIONS
MIN. - - - - - - - - -
TYP.
MAX.
UNIT
Digital input pins; note 2 VIH VIL ILI Ci VIH VIM VIL DAC Vref(DAC) RO(ref) Io(max) RL CL Notes 1. All supply connections must be made to the same external power supply unit. 2. At 3 V supply voltage, the input pads are TTL compatible. However, at 2.0 V supply voltage no TTL levels can be accepted, but levels from 3.3 V domain can be applied to the pins. 3. When the DAC drives a capacitive load above 50 pF, a series resistance of 100 must be used to prevent oscillations in the output operational amplifier. 14 AC CHARACTERISTICS 14.1 2.0 V supply voltage VDDD = VDDA = 2.0 V; fi = 1 kHz; Tamb = 25 C; RL = 5 k. All voltages with respect to ground (pins VSSA and VSSD); unless otherwise specified. SYMBOL DAC Vo(rms) Vo output voltage (RMS value) unbalance between channels fs = 44.1 kHz; at 0 dB fs = 44.1 kHz; at -60 dB; A-weighted fs = 96 kHz; at 0 dB at 0 dB (FS) digital input - - - - - 0.5 0.1 -80 -37 -75 -35 - - - - - - V dB dB dB dB dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT reference voltage Vref(DAC) reference output resistance maximum output current load resistance load capacitance note 3 (THD + N)/S < 0.1%; RL = 800 with respect to VSSA 0.45VDD - - 3 - 0.5VDD 12.5 tbf - - 0.55VDD - - - 50 V k mA k pF HIGH-level input voltage LOW-level input voltage input leakage current input capacitance at 2.0 V supply voltage at 3.0 V supply voltage at 2.0 V supply voltage at 3.0 V supply voltage 1.3 2.0 -0.5 -0.5 - - 0.9VDDD 0.4VDDD 0 3.3 5.0 +0.5 +0.8 1 10 V V V V A pF
3-level input: pin PCS HIGH-level input voltage MID-level input voltage LOW-level input voltage VDDD 0.6VDDD 0.5 V V V
(THD + N)/S total harmonic distortion-plus-noise to signal ratio
fs = 96 kHz; at -60 dB; A-weighted -
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Philips Semiconductors
Preliminary specification
Low power audio DAC
UDA1334TS
SYMBOL S/N
PARAMETER signal-to-noise ratio
CONDITIONS fs = 44.1 kHz; code = 0; A-weighted fs = 96 kHz; code = 0; A-weighted MUTE = HIGH; A-weighted - - - - fripple = 1 kHz; Vripple = 30 mV (p-p) -
MIN.
TYP. 97 95 110 100 60
MAX. - - - - -
UNIT dB dB dB dB dB
cs PSRR
channel separation power supply rejection ratio
14.2 3.0 V supply voltage VDDD = VDDA = 3.0 V; fi = 1 kHz; Tamb = 25 C; RL = 5 k. All voltages with respect to ground (pins VSSA and VSSD); unless otherwise specified. SYMBOL DAC Vo(rms) Vo output voltage (RMS value) unbalance between channels fs = 44.1 kHz; at 0 dB fs = 44.1 kHz; at -60 dB; A-weighted fs = 96 kHz; at 0 dB S/N signal-to-noise ratio fs = 44.1 kHz; code = 0; A-weighted fs = 96 kHz; code = 0; A-weighted MUTE = HIGH; A-weighted cs PSRR channel separation power supply rejection ratio at 0 dB (FS) digital input - - - - - - - - - fripple = 1 kHz; Vripple = 30 mV (p-p) - 0.75 0.1 -90 -40 -85 -37 100 98 110 100 60 - - - - - - - - - - - V dB dB dB dB dB dB dB dB dB dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
(THD + N)/S total harmonic distortion-plus-noise to signal ratio
fs = 96 kHz; at -60 dB; A-weighted -
14.3 Timing VDDD = VDDA = 1.8 to 3.6 V; Tamb = -20 to +85 C; RL = 5 k. The typical timing is specified at fs = 44.1 kHz (sampling frequency). All voltages with respect to ground (pins VSSA and VSSD); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
System clock timing (see Fig.4) Tsys system clock cycle time fsys = 256fs fsys = 384fs fsys = 512fs tCWH tCWL system clock HIGH time system clock LOW time fsys < 19.2 MHz fsys 19.2 MHz fsys < 19.2 MHz fsys 19.2 MHz 35 23 17 88 59 44 780 520 390 ns ns ns
0.3Tsys - 0.4Tsys - 0.3Tsys - 0.4Tsys -
0.7Tsys ns 0.6Tsys ns 0.7Tsys ns 0.6Tsys ns
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Philips Semiconductors
Preliminary specification
Low power audio DAC
UDA1334TS
SYMBOL
PARAMETER
CONDITIONS -
MIN. - - - - - - - - -
TYP.
MAX.
UNIT
Serial interface timing (see Fig.5) fBCK tBCKH tBCKL tr tf tsu(DATAI) th(DATAI) tsu(WS) th(WS) bit clock frequency bit clock HIGH time bit clock LOW time rise time fall time set-up time data input hold time data input set-up time word select hold time word select 64fs - - 20 20 - - - - Hz ns ns ns ns ns ns ns ns 50 50 - - 20 0 20 10
handbook, full pagewidth
t CWH
t CWL Tsys
MGR984
Fig.4 System clock timing.
handbook, full pagewidth
WS th(WS) tf tsu(WS)
tBCKH tr BCK tBCKL Tcy(BCK) DATAI
tsu(DATAI) th(DATAI)
MGL880
Fig.5 Serial interface timing.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
15 APPLICATION INFORMATION
UDA1334TS
handbook, full pagewidth
analog supply voltage R7 1
digital supply voltage R6 1
C9 47 F (16 V) C10 100 nF (63 V) VSSA system clock R5 47 BCK WS DATAI SFOR1 SFOR0 SYSCLK 15 6
C5 47 F (16 V) C6 100 nF (63 V)
VDDA 13 5
VSSD 4
VDDD
14 1 2 3 7 11
VOUTL C3 47 F (16 V)
R3 100 R1 220 k C1 10 nF (63 V)
left output
UDA1334TS
16
VOUTR C4 47 F (16 V)
R4 100 R2 220 k C2 10 nF (63 V)
right output
MUTE DEEM PCS
8 9 10 12
Vref(DAC) C8 100 nF (63 V) C7 47 F (16 V)
MGL879
Fig.6 Typical application diagram.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
16 PACKAGE OUTLINE SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
UDA1334TS
SOT369-1
D
E
A X
c y HE vM A
Z
16
9
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0.00 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.25 0.13 D (1) 5.30 5.10 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT369-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-04-20 95-02-04
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Philips Semiconductors
Preliminary specification
Low power audio DAC
17 SOLDERING 17.1 Introduction to soldering surface mount packages
UDA1334TS
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. 17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
17.5 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
UDA1334TS
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 18 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 19 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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Philips Semiconductors
Preliminary specification
Low power audio DAC
NOTES
UDA1334TS
1999 Nov 11
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Philips Semiconductors
Preliminary specification
Low power audio DAC
NOTES
UDA1334TS
1999 Nov 11
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/25/01/pp20
Date of release: 1999
Nov 11
Document order number:
9397 750 06399

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